* Processing
from silicon wafer to finished solar cell
* Emitter formation in diffusion furnaces using POCL3
* Back side Al/Ag screen printing
* Front side contacting: * screen printing
* or fully autiomated grain boundary detection and outlining with dispenser
* or evaporation and galvanic thickening
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* Characterisation:
* Measurement of minority carrier lifetime by photo-conductance decay
* Automatic detection of grain boundaries by optical means and by LBIC
* Profiling of sheet resistance of emitter
* Profiling of voltage across surface area of illuminated solar cell
* Light-beam induced current measurement with high position resolution
for cells with and without front metal contacts
* Contact resistance measurements of metal fingers
* Current-voltage characteristics of finished cell
* Automated daylight logging and artificial illumination of up to 100 Watts
modules and detailed IV-analysis
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Changes 30.March.2004 by J.Summhammer